O pozici
Axelera AI is not your regular deep-tech startup. We are creating the next-generation AI platform to support anyone who wants to help advancing humanity and improve the world around us.
In just four years, we have raised a total of $370 million and have built a world-class team of 220+ employees (including 49+ PhDs with more than 40,000 citations), both remotely from 18 different countries and with offices in Belgium, France, Switzerland, Italy, the UK, headquartered at the High Tech Campus in Eindhoven, Netherlands.
We have also launched our Metis™ AI Platform, which achieves a 3-5x increase in efficiency and performance, and have visibility into a strong business pipeline exceeding $100 million.
Our unwavering commitment to innovation has firmly established us as a global industry pioneer.
Co budeš dělat
- Own power-delivery design end to end, from on-die power grids to package and PCB PDN design and analysis.
- Lead advanced packaging architecture decisions for 2.5D/3D stacking, multi-chiplet integration, and interposer/substrate co-design.
- Perform SI/PI verification and sign-off across the full stack, ensuring power integrity and signal integrity targets are met.
- Collaborate with the AIIS and Silicon Engineering teams to align power delivery and packaging solutions with product and silicon requirements.
- Support thermal and integration reviews for current and future products
- Develop and maintain power-delivery methodology, flows, and design guidelines within the Custom Design toolchain.
- Identify and mitigate single-point-of-failure risks in SI/PI workstreams; mentor and grow the team's packaging expertise.
- Engage with external partners, substrate/interposer vendors, and OSAT houses to co-develop advanced packaging solutions.
Koho hledáme
- Bachelor’s or Master’s degree in Electrical Engineering, Microelectronics, or a related field; PhD is a plus.
- 7+ years of experience in power delivery and/or advanced packaging design in a semiconductor or deep-tech environment.
- Demonstrated expertise in on-die power grid design and package/PCB PDN analysis.
- Hands-on experience with 2.5D and/or 3D IC packaging technologies, multi-chiplet integration, and interposer/substrate co-design.
- Proficiency with industry-standard EDA tools for power integrity, PDN simulation, and package design.
- Ability to work cross-functionally and communicate complex technical trade-offs to diverse stakeholder groups.
- Strong written and spoken English communication skills.
Benefity
- This is your chance to shape and be part of a dynamic, fast-growing, international organization. We offer an attractive compensation package, including a pension plan, extensive employee insurances and the option to get company shares.
- An open culture that supports creativity and continual innovation is awaiting you. Collaborative ownership and freedom with responsibility is characteristic for the way we act and work as a team.
- At Axelera AI, we wholeheartedly embrace equal opportunity and hold diversity in the highest regard. Our steadfast commitment is to cultivate a warm and inclusive environment that empowers and celebrates every member of our team. We welcome applicants from all backgrounds to join us in shaping the future of AI.
